Fully Depleted Silicon-On-Insulator (FD-SOI) Technology Market in Americas, APAC and EMEA Region 2017 to 2021

MarketResearchNest.com adds “Global Fully Depleted Silicon-On-Insulator (FD-SOI) Technology Market 2017-2021” new report to its research database. The report spread across 83 pages with table and figures in it.

 

Research analysts forecast the global fully depleted silicon-on-insulator (FD-SOI) technology market to grow at a CAGR of 43.37% during the period 2017-2021.

 

About Fully Depleted Silicon-on-insulator (FD-SOI) Technology

Fully depleted silicon-on-insulator (FD-SOI) is a planar process technology that provides an ideal platform for the development of planner transistor architecture on a SOI substrate. FD-SOI helps in delivering low power, improved performance, and reduced silicon geometries. The FD-SOI technology is based on two innovations: an ultra-thin insulator layer known as buried oxide, which is placed at the top of the silicon base, and a thin layer of silicon, which is used for creating a transistor channel. Owing to this thin layer, the doping of the channel is removed. This means that the impurity atoms that lie in the semiconductor are completely removed, making it fully depleted. The combination of these two innovations is called the ultra-thin body and buried oxide (UTBB)-FD-SOI technology. The FD-SOI structure has evolved from the bulk CMOS process. The FD-SOI technology helps in providing a balance between cost, digital performance, power consumption, and mixed-signal compatibility.

 

Covered in this report

The report covers the present scenario and the growth prospects of the global fully depleted silicon-on-insulator (FD-SOI) technology market for 2017-2021. To calculate the market size, the report considers the revenue generated from FD-SOI technology.

 

Browse full table of contents and data tables at https://www.marketresearchnest.com/global-fully-depleted-silicon-on-insulator-fd-soi-technology-market-2017-2021.html

 

The market is divided into the following segments based on geography:

Americas

APAC

EMEA

 

Technavio’s report, Global Fully Depleted Silicon-on-insulator (FD-SOI) Technology Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

 

Technavio Announces the Publication of its Research Report – Global Fully Depleted Silicon-on-insulator (FD-SOI) Technology Market 2017-2021

 

Technavio recognizes the following companies as the key players in the global fully depleted silicon-on-insulator (FD-SOI) technology market: GLOBALFOUNDRIES, SAMSUNG, STMicroelectronics, and SOITEC.

 

Other Prominent Vendors in the market are: Dream Chip Technologies, INVECAS, and VERISILICON.

 

Commenting on the report, an analyst from Research team said: “The latest trend gaining momentum in the market is Emergence of IoT. IoT can be defined as a network of physical objects or things embedded with electronics, software, sensors, and network connectivity. IoT involves M2M communication that enables devices to exchange information and act upon information, thereby eliminating the need for human-to-computer or human-to-human interactions. In node-to-node communication, each device would function as a smart node by sensing information, bandwidth reduction, and filtering the noise by low-level signal processing. These nodes help to communicate and protect information with the help of a centralized system called the cloud. The information is then sent to people. The number of IoT devices is expected to reach more than 25 billion by 2021. IoT integrates machine learning systems and big data technology and harnesses sensor and actuator data.”

Order a Purchase Report Copy at https://www.marketresearchnest.com/purchase.php?reportid=250708

 

According to the report, one of the major drivers for this market is Smaller die sizes. A wafer is diced into a number of pieces, and each piece is called a die. A die is a semiconductor material on which a circuit is fabricated. To cut down on costs, vendors are opting for die shrinking. Die shrinking is a process in which an identical circuit is designed using an advanced fabrication process. The process involves the production of many dies from the same wafer, thereby decreasing the cost per product.

 

Further, the report states that one of the major factors hindering the growth of this market is Challenges associated with 10-nm FD-SOI design. Most of the foundry customers are scaling below 28-nm FD-SOI, which makes the process more expensive and difficult. The lithography wavelength is at its peak at 20 nm. Nodes below 20 nm require double patterning, leading to an increase in wafer cost that impacts the overall chip cost. At lower nodes, the major concerns are lower power consumption and higher speed. Both 16-nm and

14-nm FinFET can provide these two functionalities, which is difficult in other technology nodes. The physical structures of these technology nodes are designed in such a way that they reduce the time consumed and uncertain iterations.

 

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

 

Key questions answered in this report: What will the market size be in 2021 and what will the growth rate be; What are the key market trends; What is driving this market; What are the challenges to market growth; Who are the key vendors in this market space; What are the market opportunities and threats faced by the key vendors; What are the strengths and weaknesses of the key vendors;

 

Enquiry before Buying at https://www.marketresearchnest.com/enquirybuy.php?reportid=250708

 

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